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Publication details
Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles
Authors | |
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Year of publication | 2014 |
Type | Article in Periodical |
Magazine / Source | Electronic Materials Letters |
MU Faculty or unit | |
Citation | |
Web | http://link.springer.com/article/10.1007%2Fs13391-013-3148-5# |
Doi | http://dx.doi.org/10.1007/s13391-013-3148-5 |
Field | Material fatigue and breakage mechanics |
Keywords | Ag; Cu; pevnost ve smyku; zkouška; nanočástice; |
Attached files | |
Description | In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150C, 200C, 220C and 350C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the material’s mechanical properties. Furthermore, interestingly high values of shear strength were observed. |
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