Publication details
Interaction of Cu, Sn, and Ag nano-powders with Cu substrate
| Authors | |
|---|---|
| Year of publication | 2009 |
| Type | Conference abstract |
| MU Faculty or unit | |
| Citation | |
| Description | The contribution deals with nano-particles and raised from selected pure metals (Cu, Ag, Sn). The temperature behaviours of these powders under inert atmosphere and under reactive gas are studied as well as the particles / Cu substrate systems. The measurements of the thermal stability of the metal particles were obtained using DSC. It enables to evaluate heat effects of oxidation process, sintering, solid and liquid temperatures. The Cu-substrate / metal powder interlayer / Cu-substrate sandwich samples were also investigated experimentally using DSC technique. This experiment simulates real soldering process using sandwich samples inside DSC. The microstructure and phase compositions of the samples obtained in consequence of different temperature/rate/atmosphere conditions inside DSC were investigated. The samples were investigated: microstructure, porosity, phase composition, diffusion profiles, etc. (SEM, WDX, TEM). The CALPHAD approach was used for the phase diagram calculations. |
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