Informace o publikaci
Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates
| Autoři | |
|---|---|
| Rok publikování | 2012 |
| Druh | Článek v odborném periodiku |
| Časopis / Zdroj | Intermetallics |
| Citace | ETSCHMAIER, Harald, Jiří NOVÁK, Hannes EDER a Peter HADLEY. Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates. Intermetallics. Netherlands: Elsevier, 2012, roč. 20, č. 1, s. 87-92. ISSN 0966-9795. Dostupné z: https://dx.doi.org/10.1016/j.intermet.2011.08.014. |
| Doi | http://dx.doi.org/10.1016/j.intermet.2011.08.014 |
| Klíčová slova | Nanostructured intermetallics; Phase transformation; Phase identification; Joining; Thin films |