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Publication details
Three Dimensional Heteroepitaxy: A New Path For Monolithically Integrating Mismatched Materials With Silicon
Authors | |
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Year of publication | 2012 |
Type | Article in Proceedings |
Conference | 2012 International Semiconductor Conference (CAS) Vols 1 and 2 |
MU Faculty or unit | |
Citation | |
web | http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6400698 |
Doi | http://dx.doi.org/10.1109/SMICND.2012.6400698 |
Field | Solid matter physics and magnetism |
Keywords | monolithic integration; high quality Ge; elimination of cracking; threading-dislocation densities; epitaxial necking; patterned Si substrates; electrical properties |
Description | In the quest for a Ge x-ray detector monolithically integrated onto a Si-CMOS chip we developed a novel method for combining dissimilar materials that may provide a solution to the main problems of heteroepitaxy, e.g. high threading dislocation densities, wafer bowing and cracks. |
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