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Publication details
Materiály pro bezolovnaté pájky
Title in English | Lead-free Solder Materials |
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Authors | |
Year of publication | 2005 |
Type | Article in Proceedings |
Conference | Metal 05 |
MU Faculty or unit | |
Citation | |
Field | Metallurgy, metal materials |
Keywords | Lead-free solders; Sn; Ag; Cu; metallography; hardness; surface tension; intermetallics |
Description | Results of experimental measurements of selected physico-chemical properties (metalography, DTA, chemical analysis and surface tension) of 5 types of comercial lead-free solders (SnCu, SnCuSb, SnAg, SnAgCu, SnSb) and clasical solder SnPb are presented. |
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